By James J. Licari
"I suggest this ebook with out reservation to every person in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley
, Pages vii-viii
, Pages ix-x
1 - Introduction
, Pages 1-37
2 - capabilities and concept of Adhesives
, Pages 39-94
3 - Chemistry, formula, and homes of Adhesives
, Pages 95-168
4 - Adhesive Bonding Processes
, Pages 169-260
5 - Applications
, Pages 261-346
6 - Reliability
, Pages 347-391
7 - try and Inspection Methods
, Pages 393-430
, Pages 431-439
, Pages 441-457
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Additional info for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability
The oil film, being hydrophobic, increases the contact angle of the adhesive and reduces its flow.  A more controlled method to reduce bleedout that does not rely on vacuum baking involves treating the surface with a surfactant that leaves known concentrations of hydrocarbon films. These films behave the same way as the oils backstreaming from the vacuum pump.  Thus, there is a tradeoff and a fine line between achieving good wettability to insure high adhesive strength and reduced wettability to prevent bleedout.
Thus, Eq. 3) may be modified by introducing a contact coefficient that is a function of surface roughness.  Eq. 4) Wa = k[γsv (1 + cos θ - γ´)] Factors affecting wettability. In addition to the contact angle, surface energy, and surface tension considerations just discussed, the degree of wetting depends on the pot life and gel time of the adhesive. Pot life is the useful life of an adhesive after a two-part system has been mixed or after a one-part system has been removed from a container or thawed, in the case of frozen adhesives.
Oct. � Rich, R. , Anaerobic Adhesives, Handbook of Adhesive Technology, (A. Pizzi and K. L. � Design Guidelines For Use of Adhesives and Organic Coatings in Hybrid Microcircuits, NASA Technical Memorandum TM X-64908, (Dec. � Marshall Space Flight Center Drawing MSFC 16A02053. � Licari, J. , Weigand, B. , and Soykin, C. , Development of a Qualification Standard for Adhesives Used in Hybrid Microcircuits, NASA CR-161978 (Dec. � Kraus, H. , Chip Adhesives Update, Solid State Technol. (Mar. � Ebel, G.